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Mechanical Design Engineer for Thermal Design, Antenna Automated Testing and Board Assemblies Verification (6 mth. Contract)

Posted on October 5, 2017

Description and Responsibilities:

  • Investigate and design innovative thermal cooling solutions for PERASO Baseband and Radio IC so they can operate within their defined temperature limits
  • Develop the 3D model of heatsinks for PERASO products
  • Design enclosures for USB Dongles (plastic or metallic)
  • Engage with external vendors for test and production and seek out more economical and robust production solutions
  • Create mechanical drawings for our IC packages, antenna packages/modules and for thermal solutions (heat-sinks and cases)
  • Verify board assemblies by checking component clearances, connector mating tolerances, and calculating stress/strain on PCB due to mounting screws etc
  • Measure thermal performance of proposed solution using IR meter, thermos-couple, power meter, current meter, temp chamber and other lab equipment
  • Work with automated motorized equipment such as putting together a room emulator or antenna measurement system



  • Working knowledge with SolidWorks 2016 x64 Edition
  • Strong knowledge of fluid dynamic and heat transfer
  • Strong knowledge of manufacturing processes (injection molding, CNC, milling etc) and their limitation/issues. Knowledge and connections with local and overseas production and prototype vendors is an asset
  • At least Bachelor degree in Mechanical or Mechatronics Engineering and 3 years experience in the field of Thermal Design
  • Awareness of antenna radiation and mm wave EM techniques as it pertains to antenna/case enclosures is an asset

How to Apply:

If you are interested in applying for this position send your resume

Peraso Technologies is committed to supporting the Integrated Accessibility Standards Regulation (Ontario), ensuring accommodation for people with disabilities throughout the recruitment process and employment life cycle.

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